冻融循环下硅质聚苯板体系保温性能研究
郭书源,赵 敏,武 昕

(西安工业大学 建筑工程学院,陕西 西安 710021)

冻融循环; 含湿量; 硅质聚苯板体系; 导热系数

Study on heat-insulated property of silicon polystyrene board under freeze-thaw cycles
GUO Shuyuan,ZHAO Min,WU Xin

(School of Civil and Architecture Engineering,Xi'an Technological University,Xi'an 710021,China)

freeze-thaw cycles; moisture content; silicon polystyrene board system; thermal co-nductivity

DOI: 10.15986/j.1006-7930.2020.02.017

备注

对硅质聚苯板体系进行不同含湿量的冻融循环耐久性试验,结果表明:硅质聚苯板体系随着冻融循环次数的增长,导热系数不断增大,保温性能不断降低,其中50次冻融循环后导热系数的平均增长率为99.4%; 随着硅质聚苯板保温体系含湿量的不断增加,导热系数降低速度增快,其中浸水4h的试样在50次冻融后的导热系数增长率为124.67%; 硅质聚苯板体系增加防水措施后,导热系数增长率为44.85%.因此,建议在使用硅质聚苯板体系作为建筑外墙外保温体系时增加防水工艺.

Freeze-thaw cycles durability tests of silicon polystyrene board system with diff-erent moisture content,are carried out. The experimental results show that the The number of freezing-thawing cycles increased caused the thermal conductivity of silicon polystyreneboard system increased, The average growth rate of thermal conductivity after 50 freezing-thawing cycles was 99.4%; with the continuous increase of moisture content in the thermal insulation system of silicon polyphenylene board, the thermal conductivity decreases rapi-dly. The thermal conductivity growth rate of the sample soaked for 4h after 50 freezing-t-hawing cycles is 125%. The thermal conductivity of silicon polyphenylene board system increased by 44% after adding waterproof measures. Therefore, it is suggested to add water-proof technology when using silicon polyphenylene board system as the external insulation system of building external walls.